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Over the last years, singulation of thin semiconductor wafers with (ultra) low-k top layer has become a challenge in the production process of integrated circuits. The traditional blade dicing process is encountering serious yield issues. The seissues can be addressed by applying a laser grooving process prior to the blade dicing, which is the process of reference nowadays. However, as wafers are...
Fan-out wafer level packaging (FOWLP) not only provides simplified supply chain management and lower cost structure, but also enables thinner profile and heterogeneous system integration. FOWLP is becoming increasingly significant and is projected to drive growth in advanced packaging for the foreseeable future. There are many different processing technologies for fabricating FOWLP. One common key...
The introduction of Chip Scale Package (CSP) has become one of the key packaging solutions in the recent semiconductor industry. With the advantages of reducing the package size and stacking capability for higher interconnects, CSP's are continuously evolving into many different types of CSP's packages. One of the key innovative package solutions is the molded wafer level CSP (M-WLCSP)1,2 due to the...
Expanding FOWLP (Fan-Out Wafer-Level Packaging) from mainly 2D single or multi die solutions to 3D stacked multi-die solutions with SMDs integration, is of crucial importance to meet the requirements arising from new markets such as IoT/IoE and Wearables. This drives the development of new capabilities and technology breakthroughs in the current FOWLP process. One of the most hailed capabilities of...
This paper reports the demonstration of 2-5 µm embedded trench formation in dry film polymer dielectrics such as Ajinomoto build-up film (ABF) and Polyimide without using chemical mechanical polishing (CMP) process. The trenches in these dielectrics were formed by excimer laser ablation, followed by metallization of trenches by copper plating processes and overburden removal with surface planer tool...
The demands of higher routing density on wafer level are driven by multi-chip integrated fan-out packages and high I/O CSPs. New technologies and materials are necessary to generate lines and spaces down to 2 µm. Multi-metal layers are necessary for the higher wiring effort on panel level packaging (PLP) for example to contact dies which are embedded together. This places higher demands on the mechanical...
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