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In this paper, a novel design of bandpass filter with both reconfigurable center frequency as well as controllable fractional bandwidth is presented. Proposed is a three-pole configurable evanescent mode (CEVA) filter that based on low loss Rogers 5880 and consists of two arrays of metallic electromagnetic bandgap (EBG) posts that oriented in both horizontal and vertical direction. In simulation model,...
This paper presents the development of Al-Ge eutectic bonding for wafer level chip scale packaging of MEMS sensors. Al is sputtered on the MEMS wafer while an Al/Ti/Ge stack is sputtered on the cap wafer. The bonding temperature and bonding time are 430°C and 30min, respectively. A CMOS compatible Ti/Ni stack was deposited as getter on the cap wafer to maintain the vacuum level inside the cavity....
Advanced packaging technology plays more and more important role for device miniaturization, system integration, and performance enhancement. Among many new packaging technologies, fan-out wafer level packaging (FOWLP) aroused more interests and showed the advantages of higher number of I/Os, integration flexibilities, low cost, and small form factor due to the elimination of substrate. However, FOWLP...
As power demands for microelectronic devices continue to rise, new techniques for heat dissipation require innovative fabrication solutions such as on-chip cooling methods. The mechanical reliability of these high-powered, high-pressure systems is particularly sensitive to the interfacial strengths within the microelectronic architectures. In research at Georgia Tech, on-chip cooling methodologies...
We have developed a GPS product to eliminate the enclosure by creating a hollow cavity between active dice and the package substrate. To create the hollow cavity, we use a 2-layer sheet overmold to prevent mold compound encroaching under the dice. Flipped SAW filter and GaAs low noise amplifier (LNA) dice with gold stud bumps are attached to Ultra Low-footprint CSP (ULC) co-fired ceramic substrate...
This paper reports on the successful implementation of a wafer-level vacuum-packaged, CMOS-compatible aluminum nitride (AlN) based microelectromechanical system (MEMS) energy harvester (EH). The reported EH features high Q-factor (709.3) and high-g survivability (harmonic at 20g), achieved through wafer-level vacuum-package scheme which reduces the air damping effect and increases the Q-factor, overcoming...
Ultra-thin, panel-level glass fan-out packages (GFO) were demonstrated for next-generation fan-out packaging with high-density high-performance digital, analog, power, RF and mm-wave applications. The key advances with GFO include: 1) large area panel-scalable glass substrate processes with lower cost, 2) silicon-like RDL on large panels with 1-2 µm critical dimensions (CD), 3) lower interconnect...
This paper describes an ultra-thin, low cost 3D glass sensor packaging platform for near-hermeticity with novel feedthrough and encapsulation technologies. Glass panels of thicknesses ranging from 50 µm to 300 µm are used which limits overall form factor to 10 MPa) and Dow Chemical's Benzocyclobutene (BCB) 14-P005 is found to be the best candidate for panel level glass-glass bonding. Modelling of...
This paper reports on thermal performances characterization of a new high power Distributed Feedback (DFB) laser diode technology for Yb, Er and Yb/Er doped fiber lasers demanding a very narrow and stable absorption line close to 975nm. In order to overcome these limitations in terms of spectral linewidth and wavelength stabilization, an integrated distributed feedback structure is proposed. The pump...
A grating coupler (GC) in a thin film waveguide is an integrated-optic component for coupling a guided wave to/from a free-space wave via the waveguide surface. A GC in a waveguide cavity resonator can provide high-efficiency vertical coupling with small aperture. The coupling efficiency was discussed with a dependence on a position of the GC in the cavity resonator by using an analytical model based...
In this paper, we propose a fused silica packaging platform with a micro-cavity designed to house and protect active electronics for neural interfaces. Proof-of-concept test vehicles were specifically designed, fabricated, and packaged in order to evaluate the ability of the packaging to protect against water and ion incursion. Accelerated degradation testing of three test vehicles in physiological...
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