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Thermo-compression bonding (TCB) is an important electronic packaging process which applies heat and pressure to form arrayed interconnections in simultaneity. TCB processes need to be optimized to ensure low thermal variation in order to produce uniform and reliable bonds. Due to the form factors and complex structures involved in TCB, it is difficult to determine thermal variations during bonding...
We report detailed observations for temperature deviation (dT) on stacked dice and temperature for satellite dice (Ts) on several base materials with different thermal resistances to inspire new concepts for innovative collective bonding under a Thermal-compression Bonding (TCB) process. We also developed an enhanced Non-conductive Film (NCF) and flip-chip bonder, in order to solve current problems...
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