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Low-power VLSI circuits are indispensable for almost all types of modern electronic devices, from battery-driven mobile gadgets to harvested-energy-driven wireless sensor systems. However, the testing of such low-power VLSI circuits has become a big challenge, especially due to the excessive power dissipation during scan testing. This paper will highlight three major test-power-induced problems (namely...
This paper reports a mechanical test platform for micropore-arrayed membrane with a Chromatic Confocal Imaging to measure the deflection. A demonstration of the measurement is presented by testing a Parylene C filtration membrane. The test result is analyzed by a classical model of thin plate deflection and the deformation of the membrane in filtration process is estimated.
This paper describes algorithms and simulation verification of low-distortion sinusoidal signal generation methods with harmonics and image cancellation using an arbitrary waveform generator. We show high-frequency sinusoidal signal generation algorithms with HD3 image cancellation, HD3 & HD5 images cancellation, and point out that even harmonics images (such as HD2 image) is not required because...
In this paper a wafer-level chip-scale packing (WLCSP) for si-based driver using bump technique will be presented. The WLCSP is completely fabricated using conductive redistribution layer (RDL) technology which include dielectric material polyimide (PI) and RDL metallization, then the copper bumps are electroplated on the under bumping metallization (UBM) layer. The diameter of the bump is 200um and...
This paper describes a novel Ultra-Fast Single Pulse technique (UFSP) [1, 2] for accurate mobility evaluation, including the technique principle, how to connect the device, and how to use the Clarius software in the 4200A-SCS Parameter Analyzer.
On-chip electrostatic discharge (ESD) protection are required for all ICs. Unfortunately, ESD-induced parasitic capacitance (CESD) will seriously affect performance of high-speed and RF ICs. Careful design balance of ESD protection level and minimizing ESD-induced circuit performance degradation has become a major design challenge for high-speed and RF ICs. This paper presents a comprehensive study...
Significant change has occurred in the ESD and EOS testing of components and systems [1–7]. Evolutionary and revolutionary changes has occurred in the electronic industry in the area of testing of components and systems. In this paper, testing will be discussed in ESD, EOS, latch-up, and electromagnetic compatibility (EMC) and the evolution of new testing standards, test equipment, and testing methodologies.
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