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Heat-resistance of novel encapsulating materials made from thermosetting imide/silsesquioxane nanocomposites are demonstrated in SiC-SBD packages, which are die-attached with a sintered Ag paste. The test specimens are exposed to thermal cycling between −50°C and 250°C and humidity resistance evaluation test at 121°C, 0.19MPa, 95%Rh. The results reveal that the excellent heat and humidity-resistance...
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