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Resistive switching memories have been identified as an enabling technology for a variety of emerging computing applications, including neuromorphic and logic-in-memory computing. For example, analog tuning of the memory state combined with high integration density of memristors is needed for very compact implementation of synapses, the most numerous devices in artificial neural networks and would...
3DVLSI is an emerging more than Moore technology. In this paper, we propose 3D design methodologies dealing with process variability. Using SPICE models and Monte Carlo simulations we show a delay partioning method for stacked circuits to reduce frequency dispersion by 30%. We also compare how the process correlation between tiers influences the design corners.
3D VLSI with a CoolCube™ monolithic integration flow allows vertically stacking several layers of devices with a unique connecting via density above tens of million/mm2. This results in increased devices density and gains in power and performance thanks to wire-length reduction without the extra cost associated to transistor scaling. In addition to power saving, this true 3D integration opens perspectives...
While the 3D sequential process is still under development, the electrical influence of specific process for the bottom tier needs to be studied. As another MOS transistor layer is fabricated on top of the bottom one, contamination risk and thermal stability issues appear, thus requiring adaptation of conductors/dielectrics for intermediate Back-End Of Line (iBEOL) processing. As materials differ...
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