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In this work, we have experimentally demonstrated for the first time, an Analog-to-Digital Converter (ADC) based on the unique voltage-dependent switching probability of a Magnetic Tunnel Junction (MTJ). The switching probability was calculated by applying repetitive voltage pulses and measuring the resolved MTJ states in each sampling time window. Temperature sensitivity and MgO breakdown issues...
Endurance and retention are measured in 1Xnm Triple Level Cell (TLC) NAND and the flexible nLC scheme (flex-nLC) is proposed to improve reliability. This method enables the use of lowest-cost TLC NAND as is, in long term storage applications such as cold flash and digital archive: millennium memory, which have 20 and 1000 years retention, respectively.
Retention characteristics of a 3-D NAND flash cell with tube-type poly-Si body are investigated at a high temperature (T) depending on program (P), neutral (N), and erase (E) states of adjacent cells. The trap density (Nt) in the nitride storage layer of the cell is extracted by utilizing retention model and deriving related equations in cylindrical coordinate. By programming or erasing adjacent cells,...
A novel physical unclonable function (PUF) that based on random telegraph signal noise (RTN) is proposed and studied in this work. Firstly, systematical experiments have been done in ultra-scaled devices with various gate stack structures. It is found for the first time that strong correlations between trap time constants and thermal activation energies universally exist in all devices, no matter...
Based on physically-extended methodology, measurements and simulations show that implementing high-mobility materials and particularly alloys, such as a SiGe buffer for mobility enhancement in a Ge channel, can result in a 115% increase in self heating in the N7 node, compared to standard Si FinFETs.
A test circuit for studying Electromigration (EM) effects under realistic high frequency AC stress was implemented in a 32nm High-k Metal Gate (HKMG) process. Four different stress patterns (DC, pulsed DC, square AC and real AC) can be generated using on-chip circuits. Local heaters are used to raise the die temperature to >300°C for accelerated testing. Experiment results over 52.7 hours show...
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