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With the increasing complexity of VLSI circuits and systems, their testing is becoming increasingly complex and time consuming. Apart from affecting the design turn-around time, it poses severe challenges to the test engineers in terms of meeting the power-budget and temperature limit of the chip. Power consumption during test is often much higher than in normal mode of operation. Increasing temperature...
The microfabrication technology has had a chequered history of over 50 years in the field of microelectronics. Aggressive miniaturization of microelectronic devices has resulted in faster logic circuits; & and it has also reduced their power requirements. MOSFET device dimensions have already entered the sub-100 nanometer regime. The same successful principles of microfabrication were applied...
In the past, speedup has been achieved in a processor by increasing clock speed. Multicore processors are the new direction semiconductor companies are focusing on to get a boost in the performance. This tutorial first covers the concept of multicore, introducing its need and the challenges. The key aspects of multicore architecture design and the detailed architecture with reference to XMOS multicore...
Semi-Conductor Laboratory (SCL) Fab. has been upgraded to 8" wafer fab to support 180 nm CMOS process made available by M/s. Tower Semiconductor Ltd, Israel. This tutorial describes SCL foundry process features and capabilities. The tutorial will cover SCL Fab base line technology features, analog process modules, digital standard cell library for core and I/Os and memory modules. End to end...
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