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Through-silicon via (TSV) is a promising technology for the three dimensional (3D) IC packaging industry. Well-managed TSV alleviate routing congestion, enhancing performance of 3D ICs. The logic cells stacked through TSV are analogous to the vertices to be traversed exactly once in a graph. However, traditional Hamilton loop method is a NP-hard (non-deterministic polynomial) problem. This paper proposes...
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