The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A common mode choke coil (CMC) is mounted on the differential signal lines to suppress common mode noise propagating on differential signal lines. To evaluate the noise suppression effect of the CMC in the design phase of the equipments, 3D electromagnetic simulation considering the physical structure of the circuit, such as the pattern layout of the printed circuit board and inter connection, should...
To overcome power distribution network (PDN) design challenges such as serious power noise, large system area burden, the wireless power transfer (WPT) system in the 3D package and IC is applied. In this study, the 3D multi-helix inductor is proposed for designing the 3D package and IC with a WPT scheme and an equivalent circuit modeling is also implemented. The fabricated package WPT system represents...
An on-chip waveform monitoring technique embodies in-stack evaluation of three-dimensional integrated circuits (3D IC) regarding physical connections using through silicon vias (TSV) and electronic characteristics of signal transmission as well as noise propagation. On-chip generation of reference voltage steps and sampling timings reduces the complexity of analog signal routing in a chip stack and...
All electronic devices must meet electromagnetic compatibility (EMC) standards to ensure safe and reliable operations. Using simulations to investigate possible EMC issues during the design stage can be used to quickly identify possible issues. Realistic simulations may however result in very large scale problems, especially if one wants to include all possible environment effects. This article describes...
Radio receivers' EMC testing technology based on measurement of 3D double-frequency characteristic by the use of two frequency-sweeping signals is described. This characteristic simplifies the detection and identification of all linear and nonlinear interference responses (spurious, intermodulation, etc.) of the receiver. For four types of microwave receivers, the abilities of operation in presence...
We have applied the superposition solution combined with the method of moments into electromagnetic scattering from multiple objects so far. In this paper, we apply the multilevel algorithm for superposition solution, and show some numerical results. We show that the numerical results strongly depend on the number of subgroups.
In this paper, practical test patterns are designed to calculate the characteristics of Through-Silicon Via (TSV) pairs in a silicon interposer. Proposed test patterns include probing pads, traces and TSVs, which are modeled by a combination of impedances and admittances. Performance of the test patterns is obtained from simulation models built in full wave simulation solver. TSV response is then...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.