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Uncooled FIR-bolometer image sensors are established in many applications like building inspections, cold bridge analyses and predictive maintenance. New fields of application are discovered, like automotive night vision, advanced presence detection, gesture recognition etc. but these require a lower cost, small form factor packaging of the μ-bolometer sensors. Wafer level packaging (WLP) is seen...
In applications such as organic light emitting diodes (OLEDs) or photovoltaic cells a homogenous voltage distribution in the large anode layer needs to be ensured by including a metal grid with a transparent conductor layer. To ensure sufficient conductivity, relatively thick metal lines are used, which increases the risk of electrical shorts between the anode and the cathode. For this reason an insulating...
A novel concept of using phase change materials (PCM) to improve the thermal management of electronic components was investigated. The main idea is the smoothing of temperature peaks produced by the component itself or by high ambient temperature. This was realized by heat absorption during melting process of the PCM. Such materials can be used in powder form as additive to the standard coating material...
We demonstrate high performance porous Si based supercapacitor electrodes that can be utilized in integrated micro supercapacitors. The key enabler here is ultra-thin TiN coating of the porous Si matrix leading to high power and stability. The TiN layer is deposited by atomic layer deposition (ALD), which provides sufficient conformality to reach the bottom of the high aspect ratio pores. Our porous...
We fabricated stack layer transparent conductive IGZO thin films for TFT device applications using a sol-gel method. This research focuses on the properties of the resulting thin films to evaluate the ability of solution methods to replace current ultra-high vacuum techniques to fabricate thin films and its used devices. In this paper, we describe our high quality solution deposited technique: developing...
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