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Analytical models of stress and deformxation of through-silicon vias (TSV), relative to numerical ones, have the advantage of being inexpensive to evaluate and in providing insight. They have the additional advantage of allowing one to embed them in ECAD tools for real time design decisions. Motivated by this reasoning, in this paper, an analytical model for the three-dimensional state of stress in...
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are...
Experimental testing and microstructural characterization have revealed that lead-free solders exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. These changes are especially large in harsh environments, where the effects of aging on solder joint behavior must be accounted for and included in constitutive models when predicting...
Lead free solder materials are widely used in electronic packaging industry due to environmental concerns. However, experimental testing and microstructural characterization have revealed that Pb-free solders exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. These changes are especially large in harsh environments, where...
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