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The development of embedded and interlayer liquid cooling in integrated circuits (ICs) using silicon microchannels has gained interest in the recent years owing to the rise of on-chip heat uses that aggravate thermal reliability issues of the emerging 3D stacked ICs. Further development of such devices and their translation to commercial applications depend largely on the availability of tools and...
Through a series of numerical simulations, thermo fluid performance of wavy walled microchannels under steady and pulsatile flow regimes are examined and the phenomenon observed was explained by looking into the advection problem from dynamical systems point of view. It is observed that for steady regime, chaotic advection may happen for highly modulated channels and with a significant pressure drop...
A stainless steel direct liquid contact microchannel cold plate is investigated for the thermal management of bare die packages. Experiments are conducted for a prototype microchannel cold plate in contact with a 1.18cm2 uniformly heated thermal test vehicle. The junction-to-fluid thermal resistance is measured to be 0.21 °C/W for a water flow rate of 1 L/min thru the cold plate. Dynamic thermal characterization...
To meet the high cooling demand in the electronics industry, enhanced microchannel heat sinks were introduced. However, the intricacies and high costs associated with microfabrication technologies prove them unsuitable for application in conventional heat exchangers. Hence, the motivation to implement microscale passages in macro geometries ensues. In this study, the annular microchannel is formed...
In this study, several 2D numerical simulations on a non-Newtonian flow over a confined cylinder placed in a rectangular microchannel are carried out at different Weissenberg (Wi) numbers. In particular, the Oldroyd-B model implemented in open source code OpenFOAM is employed to capture the three basic ingredients of polymer rheology, viz., anisotropy, elasticity and relaxation. Numerical calculations...
Three-dimensional integration of multiple stacked silicon dies using Through-Silicon Vias has been recognized as a likely future direction of integrated circuit design. Yet, in contrast to previous architectures such 3D-ICs require extensive attention to thermal management from the moment of conception. Although such stacks are often associated with integrated, interlayer cooling solutions, it is...
This paper describes a convection-based alternative to conduction heat spreaders that uses liquid microchannels to remove heat directly from the transistors. The concept connects microchannels etched directly into the die with a hydraulic circuit that includes a piezo-diaphragm pump, thermally-regulated autonomous flow control valves, and a high-efficiency heat exchanger to create a stand-alone, hermetically-sealed...
Core scaling has largely replaced frequency scaling in general purpose microprocessors in the last decade. This is largely because of the high temperature and power dissipation associated with frequency scaling in traditional air cooled systems. In this paper we investigate how this trend changes when micro-fluidic cooling is added to a chip. Compared to traditional air cooling, micro-fluidic cooling...
Over the past few years there has been a steep upward trend in power consumption in electronic equipment, which in turn has led to more dissipation of heat. The current air-cooling technology has started to show limitations for high heat flux cooling. On the other hand, there are still barriers to the adoption of liquid-cooling technology such as higher procurement and operational costs, reliability...
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