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Hybrid air/liquid cooling systems used in data centers enable localized, on-demand cooling, or “smart cooling” using various approaches such as rear door heat exchangers, overhead cooling systems and in row cooling systems. These systems offer the potential to achieve higher energy efficiency by providing local cooling only when it is needed, thereby reducing the overprovisioning that is endemic to...
Improved-efficiency heat spreaders must address ergonomic- and performance-driven thermal management demands of electronic devices of increasingly thin form factor. Heat pipes offer a potential high-conductance solution, but performance limitations unique to sub-millimeter thickness devices must be characterized. Using a reduced-order, one-dimensional resistance network and a two-dimensional numerical...
An ultra-thin polymer pulsating heat pipe (PPHP) was developed by forming with UV curable polymer resin on polyethylene terephthalate films and hydrofluoroether was used as a working fluid. The casing materials were selected in consideration of compatibility between case materials and the working fluid and also the heat and pressure durability. A new apparatus was constructed to evaluate the thermal...
In this paper, a phase change material (PCM) based heat sink was proposed and its geometry was optimized for heat transfer enhancement. The thermal resistance network between the heat source and the control volume was applied to analyze the influence on heat storage performance of the phase change material based heat sink (PCMBHS) and the optimization suggestions were proposed. Besides, the heat storage...
A thermal model has been developed to simulate the performance of thermoelectric cooling for two avionics scenarios, where utilizing commercial off the shelf (COTS) components is highly desirable. Modeling predictions were validated through a series of experiments which studied the two scenarios at varying heat loads and heat sink thermal resistances. In these experiments, component temperatures were...
Microfluidic cooling shows promise in cooling next generation 3D microsystems when integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered micropin-fin heat sink dimensions are analyzed using deionized water. An experimental study of five different silicon micropin-fin arrays with a nominal height of 200 µm and diameters down to 30 µm was conducted at flow rates...
A High frequency wall temperature measurement approach at the microscale is demonstrated. This experimental approach was implemented to study the transient effect of bubbles in a slug flow regime. Air stream was injected into liquid water flow in a 210 µm deep and 1.5 mm wide horizontal microchannel to form a slug flow regime (with bubble frequency of ∼280 Hz) and the associated wall temperature variations...
Electric-drive systems, which include electric machines and power electronics, are a key enabling technology to meet increasing automotive fuel economy standards, improve energy security, address environmental concerns, and support economic development. Enabling cost-effective electric-drive systems requires reductions in inverter power semiconductor area, which increases challenges associated with...
Thermal design analysis and performance test of a 1kW thermoelectric battery cooler have been carried out in the present study. State-of-the-art electric and hybrid vehicles are using high power batteries, which generate extreme heat during charging of battery or acceleration. Therefore, appropriate temperature control of such a battery module is very critical to improve the fuel efficiency and the...
This paper investigates transient temperature prediction of microprocessor hot spot by utilizing one-dimensional thermal network with average temperature nodes. Different from traditional thermal network, introduced one-dimensional thermal network in this paper consists of not only material thermal resistances and material thermal capacitances but also thermal spreading resistances and a thermal local...
In this paper, two TGPs with monoporous sintered wick structures fabricated from spherical copper particles, are studied. The TGPs used in this study are 3″ by 5″ troughs, 4.8mm in depth, made of copper. On the back side of the trough, a 1cm2 raised section, referred to as pedestal, is used as a heater interface; pedestal is subjected to heat fluxes from 50 to 250 W/cm2 and the data is recorded when...
As LED applications continue to expand beyond lighting and sensors, the power levels and heat dissipation requirements will also continue to increase. Thermal management is becoming a major design issue for high-power LED systems. The size and weight of conventional bulk metal heat sinks cannot satisfy shrinking packaging constraints. Active cooling methods, such as forced air cooling or even pumped...
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