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This paper deals with the system design, technology and test of a novel concept of integrating Silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering...
Heat exchangers are important facilities used in data center cooling systems. The effectiveness of the heat exchangers strongly influences the thermal performance of the cooling systems. Rear door heat exchangers, in-row, overhead coolers and fully contained cabinets are some examples of executing liquid and hybrid cooling systems used in data centers. A liquid to liquid heat exchanger is an important...
Packaging of optoelectronic devices becomes more and more challenging due to higher heat generation per unit volume. We experimentally investigated the packaging thermal resistance for a semiconductor laser device and compared results for two material alternatives for the electrical passivation layer. We used the time-resolved thermoreflectance technique to obtain the time response for the thermal...
The transient behavior of IT equipment can be represented by a lumped thermal capacitance for use in data center level transient thermal simulations. Previous work has proposed a mathematical methodology to extract the necessary lumped capacitance parameters, the server's time constant and heat transfer effectiveness, via air temperature measurements. This work describes and experimentally tests that...
In this work dynamic numerical models for server, rack, and Computer Room Air Handler (CRAH) are developed and used in a room level Computational Fluid Dynamics (CFD) model. The effect of server, rack, and Computer Room Air Handler (CRAH) heat capacity is investigated in cases of server power fluctuations and CRAH failure situations.
White light emitting diodes (LEDs) are appearing in general illumination applications. Clusters of such LEDs can replace an incandescent light bulb of equal luminosity on the merit of considerably low power consumption. However the optical performance and working life of these LED packages are strongly dependent on the temperature of the p-n junction of the LED. Hence it is very critical to determine...
This paper investigates transient temperature prediction of microprocessor hot spot by utilizing one-dimensional thermal network with average temperature nodes. Different from traditional thermal network, introduced one-dimensional thermal network in this paper consists of not only material thermal resistances and material thermal capacitances but also thermal spreading resistances and a thermal local...
Compact thermal modeling of hand-held and ultra-low power microelectronic systems has recently attracted a great deal of attention. In this study time-dependent evolution of heat transfer around a flat plate was numerically investigated. The flat plate is subjected to internal heat generation from the inner boundary via a discrete heat source. It is cooled on the outer boundary via buoyancy and radiation...
Under a given set of boundary conditions, thermal performance of an electronic system is generally evaluated based on its steady state response. It is a conventional practice that actual time dependent power cycles and thermal boundary conditions are time-averaged to estimate the steady state characteristics. This approach may produce accurate results provided that the time dependency of the power...
Two, similar compact server models have recently been proposed for the purpose of capturing the effects of server thermal mass in transient data center thermal simulations. Both models predict server exhaust temperature from a known inlet temperature at any time provided the server properties of thermal capacitance (heat capacity) and thermal effectiveness are known. One model also includes a third...
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