The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, we present a generic modeling study of the interposer package thermal performance as a function of the interposer thermal properties and thickness for different temperature specifications. The modeling study is based on an extensive DOE of thermal finite element simulations that extract the maximum allowable logic power as a function of the interposer properties. A graphical representation...
Through-Silicon-Vias (TSVs) enable 3D stack of logic processor and memory dies with significant improvement in latency and energy efficiency of large memory-bound computations. However, additional layers of memory die increase IC package thermal resistance. Thermal management has been identified as a key challenge to achieve high computation power and memory density in the same package. In this paper...
Topic is feedback stabilisation of a nonlinear pool-boiling system in three spatial dimensions (3D). Regulation of its unstable (non-uniform) equilibria has great potential for application in micro-electronics cooling and thermal-management systems. Here, as a first step, stabilisation of such 3D equilibria is considered. A control law is designed that regulates the heat supply to the heater as a...
Microfluidic cooling shows promise in cooling next generation 3D microsystems when integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered micropin-fin heat sink dimensions are analyzed using deionized water. An experimental study of five different silicon micropin-fin arrays with a nominal height of 200 µm and diameters down to 30 µm was conducted at flow rates...
During the design of 2.5D and 3D integrated systems the thermal management of the whole system is important, especially in high performance systems with combinations of processor and memory dies utilizing the Wide I/O memory interface. Because cooling solutions could be very expensive they should be considered in very early design cycles. For example, the decision if the system is implemented as a...
Core scaling has largely replaced frequency scaling in general purpose microprocessors in the last decade. This is largely because of the high temperature and power dissipation associated with frequency scaling in traditional air cooled systems. In this paper we investigate how this trend changes when micro-fluidic cooling is added to a chip. Compared to traditional air cooling, micro-fluidic cooling...
Miniaturization and higher functionality have been and continue to be serious pursuits of the electronics industry. In relation to the miniaturization of package size, the 3D integration of devices using through silicon vias (or TSVs) is currently being researched extensively. 2.5D integration with a passive interposer is currently being researched as a step toward achieving the goal of complete 3D...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.