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Through a series of numerical simulations, thermo fluid performance of wavy walled microchannels under steady and pulsatile flow regimes are examined and the phenomenon observed was explained by looking into the advection problem from dynamical systems point of view. It is observed that for steady regime, chaotic advection may happen for highly modulated channels and with a significant pressure drop...
To meet the high cooling demand in the electronics industry, enhanced microchannel heat sinks were introduced. However, the intricacies and high costs associated with microfabrication technologies prove them unsuitable for application in conventional heat exchangers. Hence, the motivation to implement microscale passages in macro geometries ensues. In this study, the annular microchannel is formed...
Three-dimensional integration of multiple stacked silicon dies using Through-Silicon Vias has been recognized as a likely future direction of integrated circuit design. Yet, in contrast to previous architectures such 3D-ICs require extensive attention to thermal management from the moment of conception. Although such stacks are often associated with integrated, interlayer cooling solutions, it is...
A High frequency wall temperature measurement approach at the microscale is demonstrated. This experimental approach was implemented to study the transient effect of bubbles in a slug flow regime. Air stream was injected into liquid water flow in a 210 µm deep and 1.5 mm wide horizontal microchannel to form a slug flow regime (with bubble frequency of ∼280 Hz) and the associated wall temperature variations...
This paper describes a convection-based alternative to conduction heat spreaders that uses liquid microchannels to remove heat directly from the transistors. The concept connects microchannels etched directly into the die with a hydraulic circuit that includes a piezo-diaphragm pump, thermally-regulated autonomous flow control valves, and a high-efficiency heat exchanger to create a stand-alone, hermetically-sealed...
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