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Solid state light sources, such as light emitting diodes (LEDs), provide many inherent benefits and will dominate the lighting industry in the coming decades. While much of the industry is currently focused on packaging LED technology in standardized 19th century form factors to address the massive installed base of traditional fixtures, the unique characteristics of solid state devices can and will...
Through-Silicon-Vias (TSVs) enable 3D stack of logic processor and memory dies with significant improvement in latency and energy efficiency of large memory-bound computations. However, additional layers of memory die increase IC package thermal resistance. Thermal management has been identified as a key challenge to achieve high computation power and memory density in the same package. In this paper...
Flow boiling microgap heat sink is attractive due to its high heat transfer capability in compact spaces with a smaller rate of coolant flow than its single phase counterpart. Other advantages of this method are the ease of fabrication and implementation (direct cooling). Although there is general agreement that this system may be able to maintain greater temperature uniformity across the heat sink...
In this paper, a phase change material (PCM) based heat sink was proposed and its geometry was optimized for heat transfer enhancement. The thermal resistance network between the heat source and the control volume was applied to analyze the influence on heat storage performance of the phase change material based heat sink (PCMBHS) and the optimization suggestions were proposed. Besides, the heat storage...
In this effort, theoretical modeling was employed to understand the impact of bypass on the flow performance of air cooled heat sinks. Fundamental mass and flow energy conservation equations across a longitudinal fin heat sink and the bypass regions were applied and a generic parameter, referred as the Flow Bypass Factor, was identified from the theoretical solution that mathematically captures the...
Modern electronics feature high surface heat fluxes, particularly at localized hot spots, which can be detrimental to chip performance. While techniques have been developed to alleviate these local effects, they are typically advanced solutions using embedded cooling devices. Instead, an effective, less aggressive solution involves the adaptation of traditional micro-channel cooling to the particular...
The impact of increasing power consumption trends on a global economy with limited resources to sustain them cannot be understated. As worldwide communication requirements expand, data centers will need to be designed more efficiently to not only keep operation costs down for a business' bottom line, but also to be mindful of the world's power availability and resource supply. Therefore, the importance...
Physically larger more complex server processors are creating or exacerbating thermal and mechanical challenges in platform design. The larger processors are due, in large part, to the ever increasing core count, increasing integration, and growing I/O performance requirements which pushes pin count demand upwards on the socket thus driving higher processor loading requirements. As a direct result...
A novel approach to embedded electronics cooling with a multi-phase microfluidic heat sink termed the Piranha Pin-Fin (PPF) is presented. Several first-generation PPF devices, as well as plain-channel and solid pin-fin heat sinks, have been fabricated and experimentally tested under single-phase adiabatic conditions. Details of the PPF device geometry and microfabrication process are provided. Plots...
A thermal model has been developed to simulate the performance of thermoelectric cooling for two avionics scenarios, where utilizing commercial off the shelf (COTS) components is highly desirable. Modeling predictions were validated through a series of experiments which studied the two scenarios at varying heat loads and heat sink thermal resistances. In these experiments, component temperatures were...
Packaging of optoelectronic devices becomes more and more challenging due to higher heat generation per unit volume. We experimentally investigated the packaging thermal resistance for a semiconductor laser device and compared results for two material alternatives for the electrical passivation layer. We used the time-resolved thermoreflectance technique to obtain the time response for the thermal...
Microfluidic cooling shows promise in cooling next generation 3D microsystems when integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered micropin-fin heat sink dimensions are analyzed using deionized water. An experimental study of five different silicon micropin-fin arrays with a nominal height of 200 µm and diameters down to 30 µm was conducted at flow rates...
In order to dissipate heat from future low form factor microelectronic systems the use of piezoelectric blowers has recently attracted a great deal of attention. These zero-mass flow devices comprised of two piezoelectric membranes, whose oscillation frequency and amplitude can be electrically tuned, provide a net positive momentum which can be used to actively cool various device components. In order...
Surveillance systems have presented to be important applications for high performance thermal control devices, especially passive ones using heat pipe technology. This is usually applied when the heat source is located far from the heat sink and the use of liquid cooling or any other active thermal control system is not possible. Design and application of pulsating heat pipes (PHPs) and heat pipes...
The LED lighting market is growing annually, however high prices remain a barrier, especially in the incandescent replacement market [1]. Many LED bulbs, such as the A19 (the “classic” light bulb shape), MR16 (Multifaceted Reflector, 16 eights of an inch in diameter), and PAR30 (Parabolic Aluminized Reflector lamp, 30 eights of an inch in diameter) could benefit from the use of plastic materials to...
Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This is intensified by the high ambient conditions experience by today's modern warfighter. In many applications liquid cooling is replacing air flow through chassis for both thermal and environmental benefits. Although...
This paper investigates transient temperature prediction of microprocessor hot spot by utilizing one-dimensional thermal network with average temperature nodes. Different from traditional thermal network, introduced one-dimensional thermal network in this paper consists of not only material thermal resistances and material thermal capacitances but also thermal spreading resistances and a thermal local...
We report a new wafer-level, low-cost, scalable RF front-end packaging approach that enables heterogeneous integration of GaN integrated circuits (IC) with other ICs (Si, SiGe, InP, GaAs etc) and RF passives in a 3D package that includes RF/DC interconnects and thermal management. This is achieved by forming a composite substrate utilizing double-side polished alumina wafers with embedded electroformed...
Thermal energy of many electronic components is currently managed using a heat sink cast of a conductive metal alloy. This method requires significant secondary assembly of many sub-components such as fasteners, thermal interface materials and potting compounds.
We analyzed a new approach on porous metal heat sinks for highly integrated electronic applications aiming to address the exponential increase in the thermal management requirements of higher coefficient of performance (COP). Since the applications will be targeted to electronics cooling, we particularly look into air as the working fluid. The large area-to-volume ratio of porous structures could...
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