The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are...
Experimental testing and microstructural characterization have revealed that lead-free solders exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. These changes are especially large in harsh environments, where the effects of aging on solder joint behavior must be accounted for and included in constitutive models when predicting...
In this work, aging phenomena in solder joints have been explored by nano-mechanical testing. Using nanoindentation techniques, the elastic, plastic, and creep behavior of SAC305 solder joint materials have been explored for various aging conditions. Single crystal solder joints were first extracted from PBGA assemblies (14 × 14 mm, 0.8 mm ball pitch, 0.46 mm ball diameter), and then subjected to...
Lead free solder materials are widely used in electronic packaging industry due to environmental concerns. However, experimental testing and microstructural characterization have revealed that Pb-free solders exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. These changes are especially large in harsh environments, where...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.