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The trends towards miniaturization in the electronics industry coupled with advances in flip chip technology have increased the use of flip chip on board or direct chip attach technology in many products. This is especially true for products where re-work is not an option. Reliability issues were overcome by the use of underfill to couple the chip to the substrate and subsequently significant advances...
In this paper, we present a generic modeling study of the interposer package thermal performance as a function of the interposer thermal properties and thickness for different temperature specifications. The modeling study is based on an extensive DOE of thermal finite element simulations that extract the maximum allowable logic power as a function of the interposer properties. A graphical representation...
Nowadays, thermal designers have to deal with sophisticated 3D component packaging, enclosing several chips or conventional individually-packaged Integrated circuits with various power densities, embedded in small volumes that will drive up the complexity of their thermal management.
With increasing power density in electronics packages/modules, thermal resistances at multiple interfaces are a bottleneck to efficient heat removal from the package. In this work, the performance of thermal interface materials such as grease, thermoplastic adhesives and diffusion-bonded interfaces are characterized using the phase-sensitive transient thermoreflectance technique. A multi-layer heat...
The ever-increasing demand for more functionality of electronic and optoelectronic components led to increased packaging and thermal power densities. Higher processing density can be reached by developing thermal management solutions. The current technology in electronic packaging is to attach the die to heat spreader, using materials known as Thermal Interface Materials (TIM), such as solder or silver...
Electric-drive systems, which include electric machines and power electronics, are a key enabling technology to meet increasing automotive fuel economy standards, improve energy security, address environmental concerns, and support economic development. Enabling cost-effective electric-drive systems requires reductions in inverter power semiconductor area, which increases challenges associated with...
Ensuring adequate thermal performance is essential for the reliable operation of flip-chip electronic packages. Thermal interface materials (TIMs), applied between the die and a heat spreader form a crucial thermal junction between the first level package and external cooling mechanisms such as heat-sinks and cooling fans. Selection of a good TIM is dependent not only on its thermal properties but...
With requirements of higher power density and smaller package size, thermal management of electronic packages has become increasingly challenging since last decade. With several design parameters playing an important role in evaluation of thermal characterization parameter, design approximations can lead to significant error. Substrate design is a critical aspect of the thermal model and the current...
This paper discusses a thermal reliability testing experiment and failure analysis (FA) in 32nm SOI Si technology chip packages. Thermal performance of the TIM materials is monitored and physical failure analysis is performed on test vehicle packages post thermal reliability test. Thermomechanical modeling is conducted for different test conditions. TIM thermal degradation is observed at the chip...
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