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Modern electronics feature high surface heat fluxes, particularly at localized hot spots, which can be detrimental to chip performance. While techniques have been developed to alleviate these local effects, they are typically advanced solutions using embedded cooling devices. Instead, an effective, less aggressive solution involves the adaptation of traditional micro-channel cooling to the particular...
Three dimensional (3D) stacking of semiconductor chips has the advantages of high electrical performance, including improved bandwidth, reduced wire interconnection lengths, low cost, and heterogeneous integration. However, the power density increases sharply within the stack and the thermal management challenges become major bottlenecks. Inter-tier microfluidic cooling with microgaps with surface...
We investigated two phase heat transfer in staggered and inline micro pin fin arrays, using deionized water and HFE-7200 as working fluids with exit qualities up to 90%,. The inline and staggered arrays have equivalent pin fin width of 153µm and height of 305µm on a heated base area of 0.96cm width by 2.88cm length. Mass fluxes ranged from 200 kg/m2s to 600 kg/m2s for HFE-7200 and 400 kg/m2s to 1300...
We analyzed a new approach on porous metal heat sinks for highly integrated electronic applications aiming to address the exponential increase in the thermal management requirements of higher coefficient of performance (COP). Since the applications will be targeted to electronics cooling, we particularly look into air as the working fluid. The large area-to-volume ratio of porous structures could...
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