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In this study, several 2D numerical simulations on a non-Newtonian flow over a confined cylinder placed in a rectangular microchannel are carried out at different Weissenberg (Wi) numbers. In particular, the Oldroyd-B model implemented in open source code OpenFOAM is employed to capture the three basic ingredients of polymer rheology, viz., anisotropy, elasticity and relaxation. Numerical calculations...
This paper evaluates the impact of pressure drop in server racks on the cooling of the IT equipment. The measured impedance curves for servers internal resistance, rack doors, and Cable Management Arms (CMA) are used to estimate the reduction in the cooling airflow rate. In this study, 1 RU and 2 RU servers, and a 9 RU server simulator are used as representative IT equipment. A Computational Fluid...
A novel approach to embedded electronics cooling with a multi-phase microfluidic heat sink termed the Piranha Pin-Fin (PPF) is presented. Several first-generation PPF devices, as well as plain-channel and solid pin-fin heat sinks, have been fabricated and experimentally tested under single-phase adiabatic conditions. Details of the PPF device geometry and microfabrication process are provided. Plots...
A model for a basic hot aisle/cold aisle data center configuration was built and analyzed using the commercial computational fluid dynamics (CFD) software FloTHERM. The CFD study was motivated by experimental data that sho wed air recirculatio n from the hot aisle to the cold aisle through the gap between the floor and the bottom of the server cabinet. This flow can be attributed to lower values of...
Thermal management has become a critical part of advanced micro and nano electronics systems due to high heat transfer rates. More constraints such as compactness, small footprint area, lightweight, high reliability, easy-access and low cost are exposed to thermal engineers. Advanced electronic systems such as laptops, tablets, smart phones and slim TV systems carry those challenging thermal needs...
Under a given set of boundary conditions, thermal performance of an electronic system is generally evaluated based on its steady state response. It is a conventional practice that actual time dependent power cycles and thermal boundary conditions are time-averaged to estimate the steady state characteristics. This approach may produce accurate results provided that the time dependency of the power...
Two, similar compact server models have recently been proposed for the purpose of capturing the effects of server thermal mass in transient data center thermal simulations. Both models predict server exhaust temperature from a known inlet temperature at any time provided the server properties of thermal capacitance (heat capacity) and thermal effectiveness are known. One model also includes a third...
In an effort to improve the reliability and efficiency of data centers, racks and sometimes entire hot aisles are ducted to a dropped ceiling. The cooling performance of such systems strongly depends on IT and cooler airflow, the number and configuration of ducted objects and perforated ceiling tiles, the leakiness of the ceiling system, ceiling plenum depth, and other factors. Recently, a compact...
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