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The performance of thin-film evaporative cooling for near-junction thermal management was investigated. A liquid delivery system capable of delivering water in small volumes ranging 20∼75 nl at frequencies of up to 600 Hz was established. On one side of the silicon chip, a resistive heating layer of 2 mm × 2 mm was fabricated to emulate the high heat flux hot-spot, and on the other side a superhydrophilic...
Phase separation in two-phase microfluidic exchangers is a promising strategy for reducing the required pumping power. Past research has focused on using hydrophobic nanoporous structures in order to extract water vapor and retain liquid within the vapor-cooling device. This study focuses on characterizing the bursting pressure, the maximum Laplace pressure for liquid containment, of nanoporous alumina...
We report the design, fabrication and modeling of a thin film evaporation device for cooling of high performance electronic systems. The design uses a membrane with pore diameters of ∼100 nm to pump liquid via capillarity to dissipate the high heat fluxes. Viscous losses are minimized by using a thin membrane (∼200 nm) which is supported by a ridge structure that provides liquid supply channels. As...
The low contact angle hysteresis shown by superhydrophobic surfaces towards water has many interesting applications including condensation. However these useful properties can be lost during condensation. Water droplets randomly nucleate anywhere on the surface including in between the surface textures and grow while still remaining entrained in the texture. By using specially crafted textures, coalescence...
In this study, we report a new experimental method to independently and simultaneously measure the capillary pressure and permeability of wick structures and a simulation framework to establish their theoretical limits. The maximum liquid transport rates through different micropillar wick geometries operating against gravity are determined at various wicking lengths by measuring the dryout threshold...
Penetration of a wetting liquid into open metallic grooves is investigated in this work. Three grooves with different depths but the same width were tested; for each groove, a gently deposited liquid droplet serves as the reservoir for liquid penetration. High-speed imaging revealed that, after the initial stage, the penetration in the grooves is in direct proportion to the square root of time and...
Arrays of impinging jets can cool large areas with good thermal uniformity and are often used in industrial processes, such as drying and electronics cooling. However, due to cross-flow of the spent liquid and interference between adjacent jets, a significant amount of the available cooling performance is lost. Under free-surface jet impingement the area beyond the hydraulic jump is associated with...
Die attach process is widely used to realize the connection between the die, the device and the rest of the system in electronic packaging. In die attach process with solder, the reflow is necessary. During this process, the die moves under the action of capillary force induced by the liquid solder. A common phenomenon, die tilt usually occurs and strongly worsens the reliability and performance of...
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