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Solid-state lighting (SSL) products can have a predicted life of 70% lumen output (L70) from 26,000 to 40,000 hours using the LM-80-08 testing standards. Chromaticity shift, correlated color temperature (CCT) and lumen maintenance (LM) will dramatically reduce the nominal life of SSL luminaires. In this work, an off-the-shelf luminaire from Philips (AmbientLED) has been aged in a standard wet hot...
Currently, a variety of Thermal Interface Materials (TIMs) are required to meet specific requirements for various products with no single TIM meeting the needs for all CPU market segments. Surface treatments, reflow temperatures, mechanical load, performance targets all play a role in choosing a specific TIM. Based on the above multitude of conditions, it is desirable to find a universal TIM that...
Physically larger more complex server processors are creating or exacerbating thermal and mechanical challenges in platform design. The larger processors are due, in large part, to the ever increasing core count, increasing integration, and growing I/O performance requirements which pushes pin count demand upwards on the socket thus driving higher processor loading requirements. As a direct result...
Global warming highlights the effect of light-emitting diodes (LEDs), the advantages of which include lo w pollution and power consumption, as well as a long operation lifetime. However, LED research and development is limited by Illuminating Engineering Society of North America (IES) LM-80-08. This standard reliability test, which is utilized by most LED companies, is time-consuming and prolongs...
Ensuring adequate thermal performance is essential for the reliable operation of flip-chip electronic packages. Thermal interface materials (TIMs), applied between the die and a heat spreader form a crucial thermal junction between the first level package and external cooling mechanisms such as heat-sinks and cooling fans. Selection of a good TIM is dependent not only on its thermal properties but...
This paper discusses a thermal reliability testing experiment and failure analysis (FA) in 32nm SOI Si technology chip packages. Thermal performance of the TIM materials is monitored and physical failure analysis is performed on test vehicle packages post thermal reliability test. Thermomechanical modeling is conducted for different test conditions. TIM thermal degradation is observed at the chip...
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