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One of the most critical failure modes in a BGA package is the solder interconnect failure (2nd level). Conventionally, the solder damage is due to the mismatch of coefficient of thermal expansion (CTE) between the various package components and the PCB. It is absolutely critical to identify and minimize the BGA damage under thermal cycling to improve the package reliability. In the past, the critical...
In this study, we report a new experimental method to independently and simultaneously measure the capillary pressure and permeability of wick structures and a simulation framework to establish their theoretical limits. The maximum liquid transport rates through different micropillar wick geometries operating against gravity are determined at various wicking lengths by measuring the dryout threshold...
Semiconductor industry has recognized the need to replace traditional Al/SiO2 interconnects with Cu/Low-k interconnects in the mainstream electronics devices following the latter's impact on power, RC delay, and cross-talk reduction. However due to lower elastic modulus, strength, and poor adhesion characteristic, reliability of the Cu/Low-k interconnects turns out to be a concern for its integration...
During the design of 2.5D and 3D integrated systems the thermal management of the whole system is important, especially in high performance systems with combinations of processor and memory dies utilizing the Wide I/O memory interface. Because cooling solutions could be very expensive they should be considered in very early design cycles. For example, the decision if the system is implemented as a...
Over the past few years there has been a steep upward trend in power consumption in electronic equipment, which in turn has led to more dissipation of heat. The current air-cooling technology has started to show limitations for high heat flux cooling. On the other hand, there are still barriers to the adoption of liquid-cooling technology such as higher procurement and operational costs, reliability...
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