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Water-cooled server racks are typically closed cabinets, so no heat load is removed by the room cooling system in a raised floor data center. Instead, the cooling is provided by a closed system employing an air-water (fin-tube) heat exchanger. This kind of heat exchanger uses chilled water from a central plant, and there is the potential of using the waste heat that is returned. The goal of this study...
Hybrid air/liquid cooling systems used in data centers enable localized, on-demand cooling, or “smart cooling” using various approaches such as rear door heat exchangers, overhead cooling systems and in row cooling systems. These systems offer the potential to achieve higher energy efficiency by providing local cooling only when it is needed, thereby reducing the overprovisioning that is endemic to...
To keep up with the growing energy demand, legacy aircooled data centers have begun to implement simple but effective energy efficiency strategies or best practices. Improving “air management”, optimizing the delivery of cool air and the collection of waste heat, are among these efficiency strategies. One of the most powerful tools for identifying energy wasteful practices is the application of the...
One of the most critical failure modes in a BGA package is the solder interconnect failure (2nd level). Conventionally, the solder damage is due to the mismatch of coefficient of thermal expansion (CTE) between the various package components and the PCB. It is absolutely critical to identify and minimize the BGA damage under thermal cycling to improve the package reliability. In the past, the critical...
In this work dynamic numerical models for server, rack, and Computer Room Air Handler (CRAH) are developed and used in a room level Computational Fluid Dynamics (CFD) model. The effect of server, rack, and Computer Room Air Handler (CRAH) heat capacity is investigated in cases of server power fluctuations and CRAH failure situations.
A model for a basic hot aisle/cold aisle data center configuration was built and analyzed using the commercial computational fluid dynamics (CFD) software FloTHERM. The CFD study was motivated by experimental data that sho wed air recirculatio n from the hot aisle to the cold aisle through the gap between the floor and the bottom of the server cabinet. This flow can be attributed to lower values of...
Under a given set of boundary conditions, thermal performance of an electronic system is generally evaluated based on its steady state response. It is a conventional practice that actual time dependent power cycles and thermal boundary conditions are time-averaged to estimate the steady state characteristics. This approach may produce accurate results provided that the time dependency of the power...
Recently, active cooling system is strongly needed in high heat flux density microelectronics. Micropump is the essential component in the active cooling system. In this paper, a mechanical micropump is proposed for electronic cooling with a 2L/min flow rate, 90KPa pressure head at 22000 rpm (revolutions per minute). The overall size of the micropump prototype is 43mm in width and 65mm in length....
Thermal aware design of integrated circuits is essential to avoid reliability issues and failures especially in 3D-technology where active dies are placed on top of each other and more heat is dissipated on the same area available for cooling compared to conventional 2D-packages. A certain number of parameters can be selected to reduce temperature and temperature gradient. This paper is mainly focusing...
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