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In this paper we describe the most commonly used methods for analysis the mechanical properties of 3 types LTCC substrates (DuPont 951, DuPont 9K7, MuRata) based on three- and four-point bending as well as Dynamic Mechanical Analysis (DMA). The results of analysis show that the four-point bend test indicates a distribution of stress in the substrate with more accuracy and points to the tendency of...
Photovoltaic technology is evolving rapidly with new concepts and ideas to systematically improve module efficiency. Cell metallizations based on thick film pastes have to be fired less than one minute. It has already been shown that the solder interconnection of these rapid thermal firing pastes is critical in terms of wettability [1]. Main problems are solder leaching of commercially available pastes...
This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing...
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