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In this paper we describe the most commonly used methods for analysis the mechanical properties of 3 types LTCC substrates (DuPont 951, DuPont 9K7, MuRata) based on three- and four-point bending as well as Dynamic Mechanical Analysis (DMA). The results of analysis show that the four-point bend test indicates a distribution of stress in the substrate with more accuracy and points to the tendency of...
In the paper technology and properties of a differential pressure sensor utilizing ultrasonic waves are presented. The device consists of a LTCC (Low Temperature Co-fired Ceramics) membrane with PZT (Lead Zirconate Titanate) active layer with two interdigitated transducers (IDTs). The sensor is a completely ceramic structure equipped with two gas inlets, hence measurements of differential pressure...
The paper examines the feasibility of using vapour phase or infrared reflow soldering technologies for multi-layer ceramic chip (MLCC) and disk ceramic capacitors by employing the pinin-paste technology. During practical experiments recommendations are made for optimizing the thermal profiles used when soldering there types of components in order to minimize the drift in the capacitance and ESR values...
This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured — Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement....
Thick film voltametric systems for electrochemical analysis in-situ are characterized by small size, low cost and variability of a used materials [1]. A conventional alumina ceramics substrate allows a creation of only planar electrode system. Low Temperature Co-fired Ceramics (LTCC) enables to create three dimensional structure, while maintaining the similar advantageous properties of alumina ceramics,...
This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing...
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