The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The micro and nano system technologies as well as electronics are playing a key role in today's product development and industrial progress. They enable the integration of mechanical, electrical, optical, chemical, biological and other functions into a very small space with dimensions ranging from sub micrometers up to some millimeters. This paper presents different examples of MEMS sensors and systems...
A study on the effect of curvature of triangular shaped cantilevers in MEMS sensors was presented. 3-D models were performed by using the SolidWorks software. And modal analysis and harmonic response analysis were carried out on different types of geometrically configured triangular shaped cantilevers using ANSYS software. The results included the variation of natural frequencies of cantilevers and...
A closed-loop controlled interface IC on the principle of force-balance for differential-capacitive sensor system is presented in this work. Signal buffer immune for the parasitic capacitors is introduced to reduce the signal attenuation. A novel PID compensation block is designed to enhance the stability of the system with extremely high gain for accuracy, which is realized with active feedback Op...
A novel 3-D surface model for micro-manufacture process simulation is presented. This model uses unit vector of the parametric surface as an important parameter to achieve the surface evolution algorithm. According to various physical models of given fabrications, it can be applied to simulations of isotropic/anisotropic etching, deposition and other processes with surface evolution direction dependence...
Mechanisms during low pressure deposition (LPCVD) process in Micro-Electro-Mechanical Systems (MEMS) and Integrated Circuits (IC) fabrication have been analyzed. The LPCVD process has then been successfully simulated based on the re-emission models with Monte Carlo method and the Lagrangian method (shorthand denoted as L-type method) for boundary movement simulation. Simulation results show an agreement...
An overview is given for the current state-of-the-art of tunable RF elements. For this purpose, tunable RF elements such as thin-film Barium Strontium Titanate (BST) varactors, Micro Electro Mechanical Systems (MEMS) based capacitive switch banks and varactors, as well as semiconductor based capacitive switch banks and varactors are reviewed. Their benefits and shortcomings are discussed and compared...
To further improve the performance of the bias stability which is the key character for MEMS gyroscope in navigation application, a new digital self-oscillation based drive circuit with drive phase correction is proposed. Started with the gyroscope working principle, analyzed the factors that may affect the bias output. Compared with drive amplitude control which already got a higher precision, the...
TaN was widely used as Cu diffusion barrier in CMOS Cu-BEOL technology, in which it was removed by CMP process. Some work was done on TaN etch by Br/Cl-based gas for metal gate application. But seldom work was done for TaN etch in CF-based gas. In this work TaN etching in CF4/CHF3 gas was investigated on CVD alpha-Si substrate for CMOS compatible MEMS/Sensor application. To avoid resist poisoning...
This paper presents a theoretical study on the possible realization of high frequency ultrasonic phased array transducer (f > 100 MHz) using MEMS technologies. A silicon based lithium niobate (LiNbO3) single crystal linear array is considered. Finite element method is employed for the simulation optimization design of such device. Continuous wave beam steering, focusing under different array and...
A micro-acceleration latching switch with barb latching mechanism is presented in this paper. The latching mechanism which likes a “barb” can make the switch latch reliably. What's more, the flexible contacts can prevent the switch from opening due to impact resulting from the rebound or vibration of proof mass when the switch is latched. The stops which limit displacement will also improve the reliability...
A Ka-band 3 bit RF MEMS switched line phase shifter implemented in coplanar waveguide (CPW) on Borofloat™ glass substrate is presented. The basic switched line phase shifter unit is composed of two single-pole double-throw (SPDT) switches with phase offset transmission line lengths. Air-bridge with step compensation technique is used to improve the mm-wave performance of CPW discontinuities such as...
A CMOS ASIC has been designed and implemented for readout and control of MEMS vibratory gyroscopes. A low noise design is achieved by using the technique of sinusoidal chopper stabilization with a chopping frequency of 2MHz, which will effectively suppress the low frequency noise. A closed loop control method in driving mode is presented. The Chip is fabricated in a 0.35μm standard CMOS process with...
A novel micromachined fluxgate sensor with integrated solenoid coils and amorphous alloy core is developed. The ultra low power consumption is achieved due to amorphous alloys ribbon materials and optimized core structure. The device exhibits a power consumption of 2.4mW, a sensitivity of 55V/T and a linear range of -150μT-150μT as excitation current of 40mA at 40kHz.
The following topics are dealt with: silicon integrated circuits and manufacturing; digital, analog, mixed signal IC and SOC design technology; low-power, RF devices and circuits; IC computer-aided-design technology; silicon/germanium devices and device physics; interconnect, low-k, high-k, and other process technologies; advanced memories technology; unconventional and nanoelectronics; organic semiconductor...
It is very desirable to have tunable or reconfigurable RF front-end and devices for the modern wireless mobile phones since they need to operate over multiple bands, ranging from 700 MHz to 2700 MHz. The role of MEMS tunable capacitors with high Q factors is crucial in the tunable RF front-end for the modern mobile phones. In this paper, we will show the attractive performance of MEMS tunable capacitors...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.