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In this study, we propose a new technology to fabricate pseudo tri-gate vertical (PTGV) MOSFETs without p-n junctions, named junctionless PTGVMOS (JPTGV). According to numerical analysis, the excellent electrical characteristics such as subthreshold swing (S.S.) ~ 60mV/dec, Ion/Ioff ~ 1010, and low interface trap density are all achieved. The device without p-n junctions provides an easier way for...
This work presents a preliminary performance comparison between the new and conventional block oxide (BO) bulk-MOSFETs that suggests the proposed BO structure as a candidate for scaling planar CMOS to 16 nm generation and beyond. Also, the combined application of the isolation-last process (ILP) and the BO process provides a method of forming a new BO (NBO) structure that diminishes the short-channel...
A new planar-type body-connected FinFET structure produced by the isolation-last self-align process is demonstrated and characterized by using three-dimensional (3-D) numerical simulations. The new process step first defines the gate region and then the active region, thus it can achieve fully self-alignment undoubtedly. Besides, due to the isolation-last process (ILP), an additional body region (ABR)...
High-performance implant-free In0.53Ga0.47As-channel MOSFETs grown on GaAs substrates by Metalorganic Chemical Vapor Deposition (MOCVD) are demonstrated. Atomic-layer-deposited (ALD) Al2O3 was used as gate dielectric on top of a δ-doped In0.53Ga0.47As/In0.51Al0.49As metamorphic heterojunction structures grown on GaAs substrates. A 1-μm gate-length MOSFET with 15nm Al2O3 shows a maximum drain current...
We present a reliability analysis of a new vertical MOSFET with the middle partial insulation and block oxide (bMPI) structure for 1T-DRAM applications. The proposed 1T-DRAM device can increase the pseudo-neutral region due to the bMPI under the vertical channel and its device sensing current window is improved by about 95% when compared to the planer bMPI 1T-DRAM. Owing to the double-gate structure,...
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