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We report a bias dependent body resistance model for deep submicron PDSOI technology. This model is well verified by the measured data based on the 0.35μm PDSOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), and can be implemented in the SOI MOSFET compact model like BISMSOI.
The review addresses the major challenges that Nanoelectronics will have to face in the next decades. A multifaced strategy is followed to scale down CMOS based technology with new materials and disruptive architectures, heterogeneous integration, alternatives to MOSFET for information processing introducing 3D schemes at the Front End and back end levels.
With the technology scaling down to the deep sub-micron domain, leakage power increases rapidly in VLSI, enhancing the area overhead of dynamic power management system. Reverse Body Bias(RBB) is a common method to reduce the leakage power at run-time. To overcome the larger area overhead of controller applied on RBB, this paper proposes a new way of connection, which can reduce area of controller...
In this paper, a novel non-classical CMOS inverter with simple process and high integration density is proposed, which is composed of a junctionless NMOSFET and a gated N--N-N+ transistor for driver and load, respectively. Also, the gated N--N-N+ transistor performance is also investigated. Based on the numerical simulations, we find out that the carrier mobility of the gated N--N-N+ transistor is...
The minimum operating voltage, Vmin, of memory-rich nanoscale CMOS LSIs is investigated to open the door to the below 0.5-V era. A new method using a timing margin is proposed to evaluate Vmin. It shows that Vmin is very sensitive to the threshold-voltage variations, ΔVt, which become more significant with device scaling, and to the lowest necessary threshold voltage, Vt0, of MOSFETs. As a result...
Continuously down-scaling EOT and improving mobility are required for CMOS device. Small 0.6~1 nm EOT and low Vt of ~0.15 V are achieved in CMOS by using higher κ gate dielectric and novel process. The ultimate EOT scaling is limited by the inserted ultra-thin SiON interfacial layer in high-κ/Si to reduce the mobility degradation. Further mobility improvement is obtained by using Ge channel MOSFET...
A Constant-gm CMOS op-amp with Rail-to-Rail input and output stage is proposed in this paper. It is based on a novel configuration that consists of four MOSFETS as dummy differential pairs to select different differential pair as input pair, according to the different common-mode voltage. The constant gm is accomplished by avoiding the input NMOS and PMOS differential pairs operating synchronously,...
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