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Mechanisms during low pressure deposition (LPCVD) process in Micro-Electro-Mechanical Systems (MEMS) and Integrated Circuits (IC) fabrication have been analyzed. The LPCVD process has then been successfully simulated based on the re-emission models with Monte Carlo method and the Lagrangian method (shorthand denoted as L-type method) for boundary movement simulation. Simulation results show an agreement...
TaN was widely used as Cu diffusion barrier in CMOS Cu-BEOL technology, in which it was removed by CMP process. Some work was done on TaN etch by Br/Cl-based gas for metal gate application. But seldom work was done for TaN etch in CF-based gas. In this work TaN etching in CF4/CHF3 gas was investigated on CVD alpha-Si substrate for CMOS compatible MEMS/Sensor application. To avoid resist poisoning...
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