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Today non-destructive evaluation techniques become more and more important. Consequently, X-ray detectors are suitable tools to get information about specimens. In comparison to the already established scintillation principle, the direct converting method on the basis of semiconductor materials delivers several advantages. Hence, it is necessary to speed this measurement method and develop appropriate...
This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders (Sn63Pb37, Sn95,5Ag3,8Cu0,7), two types of fluxes (94-RXZ-M (IPC-ANCI-J-STD-004 - REL0), 323-ITV (C-ANCI-J-STD-004 - REL1)) and as testing material we used one-side plating PCB (FR4)...
Package-on-Package (PoP) components are BGA packages stacked on each other. With this method not only board space is saved, but signal routes are also shortened. It was presented by a cooperation of Amkor and Nokia. The vertical 3 dimensional stacking of BGA components broadens the possibilities of planar surface mounting technology. The PoP technology is constantly evolving; the latest solutions...
Various LTCC-tape materials have been characterized regarding their RF-properties at elevated temperature by means of impedance measurement of square-shaped capacitor samples up to a frequency of 3 MHz. Parameters of an equivalent circuit were fitted to reconstruct the impedance characteristics and the parameters extracted. The activation energies of samples were derived from the impedance model.
Evaluation of tin whisker growth during thermal aging combined with mechanical stress and roughing of the surface is being observed. We are using 2 types of test conditions: temperature 50°C plus humidity 93% and dry hot 75°C. Under those conditions the samples are exposed 1000 hours. We are testing electroplated copper sheet, hot dipped copper sheet with pure tin and solder SnAg. After coating samples...
The article deals with the influence of surface roughness on solderability. The area of spread test was used as a method for solderability measurement. For this measurement, test samples made from substrates for printed circuit boards, small solder balls, and two soldering technologies - vapor-phase and reflow soldering - were used. These technologies have been used because of similarity with the...
In this study an alternative way has been investigated in order to make the identification of dendrites caused failures easier. Dendrites grown during electrochemical migration (ECM) can cause shortages which can lead to catastrophic failures. ECM is a simple transport process, it can be described with electrochemical principles. Dendrites are metal or metal-oxide structures which grow from the cathode...
Topic of my article is modeling of thermomechanical stressing in modern microelectronic structures. Simulations are made using software ANSYS, which is based on Finite Element Method (FEM). Using this method, thermomechanical stressing in various structures was modeled. After simulations, data evaluation and comparison of yielded results was made to determine amplitudes and differences between stressing...
In this paper for the first time inductive excited lock-in thermography (ILT) is applied on electronic packages and modules. This non-destructive evaluation method allows the detection of subsurface defects. Previous works in this field dealt with macroscopic applications or unpackaged devices. The main goal of this paper is the suitability estimation of ILT for electronic packages and modules mainly...
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