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The results of lifetime testing of Cu/Sn-Cu eutectic bonded dice at 10μm pitch in large area arrays of 325,632 interconnects are shown. The interconnect bonding process (pressure and temperature) required for the formation of low resistance (~100 mΩ), high yielding (99.99% individual bond yield), and reliable interconnects is described. The effects of thermal cycling on electrical yield and resistance...
We present a modified Berman model that relates breakdown voltage distributions, from dual voltage ramp dielectric breakdown (DVRDB) test, to the distribution of time-to-fail (TTF) during constant voltage stress (CVS) conditions, assuming that dielectric failure behavior under a constant voltage stress follows the square-root E-model. The methodology presented in this work demonstrates a fast and...
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