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Current paper focuses on the influence of carbon nanotube (CNT) length on its thermal conductivity. The powerful technique which is molecular modeling was used. The non-equilibrium molecular dynamics was implemented in commercially available software. The eight single-walled carbon nanotubes from 50 nm to 400 nm was investigated. The obtained results show the trend of increasing thermal conductivity...
Atomic-scale computational materials engineering offers an exciting complement to experimental observations, revealing critical materials property data, and providing understanding which can form the basis for innovation. This contribution reviews the current state of atomic-scale simulations and their capabilities to predict mechanical, thermal, and electric properties of microelectronics materials...
As the market demand of high power, high frequency and high efficiency, the advanced RF power packaging and assembly technology is facing the challenge of new material and new design. Improving the thermal conductivity of the heatsink (flange) is one of the effective ways to obtain low thermal resistance (Rth) component. Compared to the silicon transistors, the low-cost, high thermal conductivity...
Thermal interface material resistance is one of the bottlenecks for efficient thermal management. Much research has been undertaken in the last years to overcome the finite thermal conductivity as well as the interface resistance of, above all, polymer-based TIMs varying material parameters such as filler particles material, size and modality as well as matrix material properties. Some improvement...
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