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The main objective of this study is to validate the thermomechanical properties of materials used in some electronic components. The improved performance of HgCdTe infrared focal plane arrays requires reliability of the assembly at low temperatures down to 77K. Unfortunately, the thermomechanical behavior of most materials of these components remains to be clarified, particularly in a cryogenic environment...
Silicon is an important semiconductor substrate for manufacturing solar cells. The mechanical and electrical properties of multi-crystalline silicon (mc-Si) are primarily influenced by the quality of the feedstock material and the crystallization process. In this work, numerical calculations, applying finite element analysis (FEA) and finite volume methods (FVM) are presented, in order to predict...
A multiphysics modeling and design has been performed for the world's largest Metal Organic Vapor Phase Epitaxy (MOVPE) reactor by combining Theory of Inventive Problem Solving (TRIZ) for concept design, Design for Six Sigma (DFSS) for shape optimization, and Computer-Aided Engineering (CAE) simulations of multi-scale from atomic to macro scales. Numerical simulations considering gas phase chemical...
Vibration is commonly encountered during the life time of electronic components. It is a major cause of failure due to cyclic strain and stress that give rise to damage in the materials making up the component. The recent move from lead to lead-free soldering by the electronics industry has necessitated the generation of material properties data that will allow accurate prediction of the lead-free...
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