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Embedding of discrete semiconductors into substrates has the advantages of achieving high degree of miniaturization, good electrical performance and possible low cost. A MOSFET power package based on the embedded die technology was developed and the demonstrators were built. To reduce cost and time-to-market, thermo-mechanical virtual prototyping is applied to support the package development. 2D and...
Actuation, sensoring and control in arrays of MEMS require spatially distributed periodic electronic circuits. For very large sized arrays, say 1000 times 1000 MEMS or cells, on the same chip, simulation requirements for electronics are far away from standard algorithm capabilities. One of the authors has shown in a theoretical paper, that a homogenization modeling method, previously developed for...
Recently there has been a lot of research based on nanoscale structures and their applications but not a significant amount of modeling and simulation methods have been presented to expedite and simplify such work. In this paper we have shown that the commercially available MEMS enabled software tools can be used to model nanoscale structures of the order of hundreds of nanometers and that this kind...
Commercial FEM software codes do not directly support the cure dependency of polymers behavior. In electronics packaging, for example, cure shrinkage of the molding compound is consequently treated as a surplus to thermal contraction and its changes in visco-elastic behavior during curing are usually ignored. This give rise to inaccurate results and may cause difficulties even in recognizing factors...
The reliability of the electrostatically actuated MEMS contact switches is known to be significantly undermined by the unstable dynamic behaviour of devices. High impact forces, bouncing at the contact and oscillations upon release result in substantial mechanical damage to the contacts and the switch compromising the functionality of the switch and reducing its lifetime. Certain effects become more...
Due to environmental consciousness and legislative regulations, Pb-free solders have been increasingly used for replacement of conventional SnPb solders in the microelectronic industry. However, during the transition period from SnPb to Pb-free solders, some products will potentially consist of mixtures of Pb-free with SnPb solders. This paper presents the results of microstructural analysis of mixed...
We present a computationally efficient multi-energy domain coupled system-level model of an electrostatically actuated RF-MEMS switch exposed to squeeze film damping. The physically-based model is systematically derived and calibrated on the basis of a hierarchical modeling approach. The model shows excellent agreement with both static and dynamic measurements performed with a white light interferometer...
A fast identification method which provides the determination of different mechanical parameters of a particular device under test has been investigated for application to micro-electromechanical beam resonators. By performing optical measurements, the frequency-dependent mechanical out-of-plane displacement has been recorded to determine the modal resonant frequencies of a selected resonator. An...
Despite extensive research over the past decades, corrosion of aluminum bond pads is still a major reliability risk for plastic encapsulated microelectronics. Nowadays even an increase in susceptibility for corrosion is observed for new waferfab technologies and encapsulation materials during reliability tests. The recent trend for the new generation encapsulation materials is to decrease the glass...
Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often used as flexible substrate for plastic electronics....
The paper focuses on influence of materials properties and molding processes parameters on warpage of bimaterial silicon-molding compound (MC) systems. The three different MCs of different glass transition temperature Tg and different coefficients of thermal expansion (CTE) were considered in numerical and experimental investigation. The post molding processes and their influence on warpage were analyzed...
Stretchable electronics offer potential application areas in biological implants interacting with human tissue. Furthermore, they facilitate increased design freedom of electronic products. Typical applications can be found in healthcare, wellness and functional clothes. A key requirement on these products is the ability to withstand large deformations during usage without losing their integrity (i...
The effects of mechanical shocks on polysilicon MEMS accelerometers are here investigated within the frame of a multi-scale finite element approach. To accurately model MEMS dynamics and possible failure events, three length-scales are explored: macroscale, characterized by stress waves propagating inside the package and eventually impinging upon sensor anchors; mesoscale, characterized by forced...
Dielectric materials are universally used in the fabrication and packaging of transistors in microelectronics and displays, as well as used in discrete devices such as sensors, switches and photovoltaics. However, as device and interconnect sizes become smaller, the question of the source of electrical failure becomes more and more important. During the development of these materials it has been found...
The simulation results show that larger contact opening may not benefit on relieving current crowding effect in the flip-chip solder joints. For the solder joints with a 10-mum thick Cu UBM, the diameter of the contact opening for the lowest current crowding effect is 60 mum. It means that using larger or smaller diameter will increase the current density in the solder bumps. In addition, the optima...
Most semi-conductor devices are encapsulated by epoxy moulding compound (EMC) material. Even after curing at the prescribed temperature and time in accordance with the supplier's curing specifications often the product is not yet 100% fully cured. As a consequence, the curing process of a product continues much longer, leading to curing effects of the EMC during the lifetime of the package. In this...
In this paper, the interaction between chip and package is investigated with the focus on low ppm-level failures. More specifically, the failure mode of inter-metal shorts is investigated, caused by either electrical discharges (ESD) or internal/external mechanical forces. It is demonstrated that forces induced by the filler particles in the molding compound can cause these shorts. Finite element...
Failure analysis in complex integrated microelectronic devices is of increasing importance to improve their reliability, quality, and manufacturing yield. Non-destructive testing methods for localisation of shorts and opens in the internal circuitry are required, particularly for complex and fully packaged devices. The method of lock-in thermography (LIT) was developed for localisation of electrically...
Interfacial delamination, due to the presence of dissimilar material systems, is one of the primary concerns in electronic package design. Continuum models such as J-integral have been developed to evaluate potential delamination by defining a pre-defined crack at selected interface in the package. The interface is modeled as a discontinuity across the mating material layer. However, at molecular...
In the present paper the automated optimization of the exposure dose for UV moving-mask lithography is presented. Moving-mask lithography is a promising new technique for micro patterning thick positive photo resists. The design task is to design the mask and the mask motion such that the requested micro pattern is achieved as good as possible. As an intermediate step towards a computational engineering...
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