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Two new designs for copper base heat sink is proposed in this work. In some experimental and numerical simulation efforts, optimizing and predicting of the thermal characterization of the heat sink with inclined free fins is developed.
This investigation is aimed at the stability of press-fit interconnections for MID. Moulded interconnect devices (MID) are 3-dimensional substrates produced by thermoplastic injection moulding for large-series applications. The assembly process of press-fit interconnections has been correctly modelled with a FE-Software. With this model the behaviour of the mechanical contact pressure, which decreases...
In this paper, we investigate the performance characteristic of CNFET inverter based on a new compact model. We consider temperature variation effects on the CNFET circuit performance implemented in a 32-nm technology. The results show in contrast to MOSFET sub-threshold current reduces in CNFET with temperature. So by using CNFET in high temperature applications we can obtain high speed and low leakage.
Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package...
It is well known that high temperature storage can degrade wire bonding contacts significantly due to interdiffusion of pad metal and bonding wire. Looking at harsh applications such as engine management we notice an additional failure mode caused by the temperature gradient during the pulsed active cycling period. Especially when we aim at components with high temperature capability and we substitute...
Environmental test is widely used to verify the adaptability and reliability of various electronic products in the last decades. The sharp change of temperature and humidity in certain situations could pose a serious reliability issue on the electronic components. This paper presents an experimental study of one kind of plastic substrate based flexible display called STN (super-twisted nematic). The...
In order to study the electrical-thermo-mechanical interaction in OLEDs, finite element based simulation models were developed. Two dimensional models were used to study detailed design effects, such as the location of the bus bars, while a three dimensional model was used to study the effect of differences between the two and three dimensional models, as well as bus bar designs.
The numerical pre-design of a novel micro-machined thermal infrared emitter, using a spider type hotplate concept is presented. The spider concept introduced allows the fast transient operation of the emitter and thus a direct modulation of the radiation without additional mechanical tools like choppers. The thermal radiation source is excited by a pulsed electrical voltage and is thermally separated...
Behavior of epoxy resin is critical for performance and reliability of electronic packages. The ability to predict properties of cross linked epoxy resin prior to laboratory synthesis will facilitate the materials design. Theoretical studies in this field face a big challenge because there is no conventional way to build atomistic models of specific polymers, which form a network. Molecular dynamics...
The components used in the automotive environment are subjected during their lives to various environmental combined stresses. The predominant failure mechanism at the package level due to these combined stresses is the ball bond lift. The failure is due to the combination of metallurgical effects, such as the intermetallic (IMC) Au-Al thickness growth, widening of Kirkendall voids and mechanical...
In this paper, a framework for fusion approach to IGBT power module prognostics is reported. A failure modes, mechanisms, and effects analysis (FMMEA) for the IGBT power module is performed to identify critical failure mechanisms. For the failure mechanisms identified, relevant physics of failure models are discussed. In addition, the parameters affected by the critical failure mechanisms are identified...
The scope of the paper is to present the result of combining experimental and simulation methodologies to determine mechanical material properties at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used in the experiments. Stress-strain data recorded at high strain rates proof the high resolution capability of a novel tensile setup. A FEM model of the...
This paper deals with the problem of accurate evaluation of global quantities related to the electrostatic fields in micro-electro-mechanical systems (MEMS). In particular, the capacitance and the electrostatic force play often an important role in the design of micro-machines. In spite of the fact that some simplified formulas have been proposed so far, in many cases it is necessary to improve the...
In the growing MEMS market wafer level thin film packages can be applied to an increasing number of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing,...
This paper gives an overview of the different monolithic approaches to compute the pull-in curve for discretized models of electrostatically actuated microsystems that are currently available in the literature. A method to implement monolithic charge loading combined with path-following is proposed. The performance of the algorithms is tested with some numerical experiments: FEM models of microbeams,...
The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In...
The electronic industry drive for miniaturization and increasing functional integration forces the development of feature sizes down to the nanometer range. Moreover, harsh environmental conditions and new porous or nano-particle filled materials introduced on both chip and package level - low-k and ultra low-k ILD materials in back-end of line (BEoL) layers of advanced CMOS technologies, in particular...
High power RF transmitters are essential components for enabling base stations, microwave, and broadcast systems. NXP is a leading RF Power supplier for more than 25 years, and our market share gain with volume. In principle, the market demands high power, high frequency and high efficiency with low thermal resistance: Efficiency larger than 30%, frequency in range of 0.7-2.5 GHz or higher, which...
Magnetic resonance imaging is a rapidly advancing and highly sophisticated non-invasive imaging technology for medical diagnosis. We are collaborating with the University Clinic to produce a novel solution for functional MRI. The project INUMAC is co-designing new gradients, excitation technology, sensors, and measurement sequences. This wholistic approach allows us to try out non-conventional ideas...
Considerable scientific efforts were made in the past decade, to come up with reliable and predictive analyses for lead-free solder interconnects, in view of their obligatory introduction a few years ago. This paper concentrates on a number of physical, computational and experimental multi-scale aspects, based on the analyses of the instabilities that occur in a Sn-Ag-Cu (SAC) alloy. Particular attention...
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