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A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between...
High power RF transmitters are essential components for enabling base stations, microwave, and broadcast systems. NXP is a leading RF Power supplier for more than 25 years, and our market share gain with volume. In principle, the market demands high power, high frequency and high efficiency with low thermal resistance: Efficiency larger than 30%, frequency in range of 0.7-2.5 GHz or higher, which...
The paper discusses the increasing need for a more sophisticated thermal characterisation of LEDs (Light Emitting Diodes) and LED-based products. It goes without saying that the LED-business is growing exponentially, in fact, much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterisation has not kept pace. The situation is becoming a serious problem for...
The purpose of this research is to enhance the structure of the 204-pin small outline dual in-line memory module (SODIMM) against the drop impact. According to the JEDEC regulations, the enhancement of PCB clips should be attempted to increase the resistance against drop impact. From high speed camera observation, the SODIMM module is pushed away from the PCB clips during drop impact. Therefore, the...
Calibrated 3-D numerical simulations are employed to quantify the influence of design parameters like emitter area, aspect ratio, distance to trenches, and thickness of AlN heatspreaders on the thermal transient behavior of silicon-on-glass (SOG) bipolar transistors. A larger silicon island enclosed in the trenches reduces the thermal resistance at the expense of a slower thermal response of the system...
The simulation results show that larger contact opening may not benefit on relieving current crowding effect in the flip-chip solder joints. For the solder joints with a 10-mum thick Cu UBM, the diameter of the contact opening for the lowest current crowding effect is 60 mum. It means that using larger or smaller diameter will increase the current density in the solder bumps. In addition, the optima...
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