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In this paper the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed. This is a topic relevant for a multi-scale framework to lifetime prediction in microelectronics packaging. To achieve that objective, epoxy-resins are synthesised by systematically varying their chemical structure and then characterised by various thermo-mechanical testing...
The through silicon interconnection technology for stacked dies is a promising way of future package construction as it lowers yield risks of large die sizes and allows cost effective packaging solutions for heterogeneous electronic systems. Thermo-mechanical reliability dependent on processing and mounting steps as well as during testing are one major concern, which was addressed by FEA. The numerical...
Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
Behavior of epoxy resin is critical for performance and reliability of electronic packages. The ability to predict properties of cross linked epoxy resin prior to laboratory synthesis will facilitate the materials design. Theoretical studies in this field face a big challenge because there is no conventional way to build atomistic models of specific polymers, which form a network. Molecular dynamics...
The use of temperature and time dependent material parameters is state-of-the-art in mechanical engineering. An advanced measurement method for the determination of moisture dependent parameters for micro and nano scale samples was developed. In combination with FE-analysis, this tool (involving time, temperature, and humidity) ensures a sure deployability. The present paper deals with the influence...
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