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Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
It is well known that high temperature storage can degrade wire bonding contacts significantly due to interdiffusion of pad metal and bonding wire. Looking at harsh applications such as engine management we notice an additional failure mode caused by the temperature gradient during the pulsed active cycling period. Especially when we aim at components with high temperature capability and we substitute...
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing, 3D-SiP, and nano interconnects have been discussed. Molecular dynamics (MD) and finite element method (FEM) have been used to study the scale effect of the material properties and the prediction of the module behaviors which are critical to LED fabrication. We propose a new concept to integrate multi-physics/multi-scale...
The temperature dependent driving force for stress induced voiding of Cu dual damascene interconnects has been studied using finite element modeling. Both 2D axisymmetric and 3D models have been investigated. Interconnect test structures have been simulated at temperatures ranging from 25 to 300degC and a stress free temperature for the structure is demonstrated, consistent with analytical modeling...
When assessing the mechanical durability of electronic assemblies, the focus is generally on the solder interconnect. However, in many package styles, such as BGAs (ball grid arrays), LGAs (land grid arrays), MLFs (micro lead frame) and QFNs (quad flat no-lead), the Cu trace emanating from the solder pad may be the weakest failure site, especially if the solder joint is copper-defined rather than...
The simulation results show that larger contact opening may not benefit on relieving current crowding effect in the flip-chip solder joints. For the solder joints with a 10-mum thick Cu UBM, the diameter of the contact opening for the lowest current crowding effect is 60 mum. It means that using larger or smaller diameter will increase the current density in the solder bumps. In addition, the optima...
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