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Behavior of epoxy resin is critical for performance and reliability of electronic packages. The ability to predict properties of cross linked epoxy resin prior to laboratory synthesis will facilitate the materials design. Theoretical studies in this field face a big challenge because there is no conventional way to build atomistic models of specific polymers, which form a network. Molecular dynamics...
The aerospace and high performance (AHP) electronics industry leans henceforth on the technologies developed for consumer applications. However, the requirements of AHP products in terms of reliability are stronger than for consumer ones. One of the factors to improve the reliability in thermal cycling of electronic assemblies is the selection of base materials for Printed Circuit Boards (PCB). In...
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