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Behavior of epoxy resin is critical for performance and reliability of electronic packages. The ability to predict properties of cross linked epoxy resin prior to laboratory synthesis will facilitate the materials design. Theoretical studies in this field face a big challenge because there is no conventional way to build atomistic models of specific polymers, which form a network. Molecular dynamics...
The components used in the automotive environment are subjected during their lives to various environmental combined stresses. The predominant failure mechanism at the package level due to these combined stresses is the ball bond lift. The failure is due to the combination of metallurgical effects, such as the intermetallic (IMC) Au-Al thickness growth, widening of Kirkendall voids and mechanical...
This paper presents a combined numerical and experimental methodology for predicting moisture-induced effects in Package-on-Package (PoP) assemblies. The hygroscopic warpage of the assembly "PoP" is measured. Its behavior is compared with the individual components "top" and "bottom". The assembly "PoP" absorbs more moisture than the sum of the two individual...
In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme. In addition, two low filled packaging polymers are included for comparison. The characterization scheme consists of the steps sample preparation, measurement of the material data, and modeling the material behavior. The dasiasample preparationpsila step included a DSC analysis to understand...
The aerospace and high performance (AHP) electronics industry leans henceforth on the technologies developed for consumer applications. However, the requirements of AHP products in terms of reliability are stronger than for consumer ones. One of the factors to improve the reliability in thermal cycling of electronic assemblies is the selection of base materials for Printed Circuit Boards (PCB). In...
Embedding of discrete semiconductors into substrates has the advantages of achieving high degree of miniaturization, good electrical performance and possible low cost. A MOSFET power package based on the embedded die technology was developed and the demonstrators were built. To reduce cost and time-to-market, thermo-mechanical virtual prototyping is applied to support the package development. 2D and...
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