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There are many optimization algorithms, which can be used to find the extremum of a function. However, in optimizing the function, which is obtained from the numerical calculations, it is necessary to apply the proper global optimization algorithm. It is caused by the high nonlinearity of the numerical function's response. The nonlinear function with not known analytical form may have many local extrema...
Two new designs for copper base heat sink is proposed in this work. In some experimental and numerical simulation efforts, optimizing and predicting of the thermal characterization of the heat sink with inclined free fins is developed.
This investigation is aimed at the stability of press-fit interconnections for MID. Moulded interconnect devices (MID) are 3-dimensional substrates produced by thermoplastic injection moulding for large-series applications. The assembly process of press-fit interconnections has been correctly modelled with a FE-Software. With this model the behaviour of the mechanical contact pressure, which decreases...
The electronic industry drive for miniaturization and increasing functional integration forces the development of feature sizes down to the nanometer range. Moreover, harsh environmental conditions and new porous or nano-particle filled materials introduced on both chip and package level - low-k and ultra low-k ILD materials in back-end of line (BEoL) layers of advanced CMOS technologies, in particular...
The development of Cu/low-k interconnects to meet continuous tighter specifications (lower RC time delay, power consumption...) and consequently the introduction of mechanically weak materials is widely identified as a contributor of interfacial cracks propagating during manufacturing flow or qualification tests. Moreover, a raise in Front-End/Back-End (FE/BE) compatibility issues has been also observed...
New design for an electro-thermally actuated SU-8 polymeric microgrippers is presented, simulated and analyzed. The electro-thermally driven microgrippers were studied using computer simulations (the Finite Element Method using CoventorWare software tool). Numerical simulations - coupled electro-thermo-mechanical simulations - were performed. We investigated the influence of the temperatures achieved...
Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials on micro-scale and nano-scale. The presented project focuses on application of the nanoindentation technique in order to extract the basic elastic and elasto-plastic...
Interfacial delamination, due to the presence of dissimilar material systems, is one of the primary concerns in electronic package design. Continuum models such as J-integral have been developed to evaluate potential delamination by defining a pre-defined crack at selected interface in the package. The interface is modeled as a discontinuity across the mating material layer. However, at molecular...
This paper discusses challenges for multi-scale Finite Element (FE) modeling in microelectronics. Its miniaturization and multi-scale nature is an enabler for in Healthcare and Well-being markets. Function integration and miniaturization enable microelectronic products having functionalities such as rollable display (Figure 1), wireless connectivity & GPS, beaming, illumination systems, body health...
The use of an innovative jet impingement cooling system in a power electronics application is investigated using numerical analysis. The jet impingement system, outlined by Skuriat et al, consists of a series of cells each containing an array of holes. Cooling fluid is forced through the device, forming an array of impingement jets. The jets are arranged in a manner, which induces a high degree of...
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