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The interfacial failure behavior of a single solder joint is investigated under the pure tensile or shear loading at 5 mm/s. The brittel failure is detected for the specimen under pure tension loading, while a ductile failure is found after pure shear loading. A cohesive zone model is employed herein to explore the dynamic fracture behavior at the solder/IMC and IMC/Cu pad interfaces. The simulated...
In this paper the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed. This is a topic relevant for a multi-scale framework to lifetime prediction in microelectronics packaging. To achieve that objective, epoxy-resins are synthesised by systematically varying their chemical structure and then characterised by various thermo-mechanical testing...
Since lead was banned from the solder joints, mechanical tests of microelectronic components and modules have gained much importance not just in mobile electronics but quite in general. The standardized JEDEC drop test is commonly used. It delivers repeatable results for a wide range of loads in the components mounted on the well specified test PCB. As yet the JEDEC drop test is time consuming and...
The scope of the paper is to present the result of combining experimental and simulation methodologies to determine mechanical material properties at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used in the experiments. Stress-strain data recorded at high strain rates proof the high resolution capability of a novel tensile setup. A FEM model of the...
3D integrated circuit technology is an emerging technology for the near future, and has received tremendous attention in the semiconductor community. With the 3D integrated circuit, the temperature and thermo-mechanical stress in the various parts of the IC are highly dependent on the surrounding materials and their materials properties, including their thermal conductivities, thermal expansivities,...
Nanoindentation technique is commonly used to characterize the mechanical properties of thin films. However, the validity of the measurements is greatly affected by the indentation depth and the substrate properties. The purpose of this study is to understand the influence of the substrate properties, the thin film thickness and the mechanical properties of the thin film itself on force-displacement...
The nanoindentation experiment is an established technique for the determination of hardness and Young's modulus of thin films. This standard data set is not sufficient to be used as input to finite element simulations , because elastic-plastic material data is being required for analysis of reliability of metal layers. Therefore stress-strain curves are being determined by fitting the force displacement...
This paper investigates a method to decide which mechanical modes need to be retained in a modal truncation for a thermomechanical problem. A more efficient reduction basis is formed by looking into more detail in the modal participation of the different mechanical modes. Based on the spatial matching properties of mechanical modes with thermal modes can be decided which modes need to be retained...
The paper reports the results of a systematic improvement project on the thermal cycle (TC) lifetime prediction of BGA memory modules with SnAg1.0Cu0.5 and SnAg1.0Cu0.5Ni0.05 solder alloys. The pre-existing lifetime modeling scheme allowed predictions with an inaccuracy factor of about 1.6plusmn1 on average while in TC experiments, the characteristic lifetime, N63, showed a standard deviation of about...
Embedding of discrete semiconductors into substrates has the advantages of achieving high degree of miniaturization, good electrical performance and possible low cost. A MOSFET power package based on the embedded die technology was developed and the demonstrators were built. To reduce cost and time-to-market, thermo-mechanical virtual prototyping is applied to support the package development. 2D and...
Commercial FEM software codes do not directly support the cure dependency of polymers behavior. In electronics packaging, for example, cure shrinkage of the molding compound is consequently treated as a surplus to thermal contraction and its changes in visco-elastic behavior during curing are usually ignored. This give rise to inaccurate results and may cause difficulties even in recognizing factors...
Interfacial delamination, due to the presence of dissimilar material systems, is one of the primary concerns in electronic package design. Continuum models such as J-integral have been developed to evaluate potential delamination by defining a pre-defined crack at selected interface in the package. The interface is modeled as a discontinuity across the mating material layer. However, at molecular...
This paper discusses challenges for multi-scale Finite Element (FE) modeling in microelectronics. Its miniaturization and multi-scale nature is an enabler for in Healthcare and Well-being markets. Function integration and miniaturization enable microelectronic products having functionalities such as rollable display (Figure 1), wireless connectivity & GPS, beaming, illumination systems, body health...
In this paper, a wrist device conception was selected to study the reliability of flexible devices by drop test simulation. In the conception device, all of the components cannot be made flexible immediately. Some of them are still rigid, such as the ball grid array (BGA), the connector, and some other big components like the vibrator. The reliability of the device, where such rigid components are...
Rigid-flexible printed circuit boards (RFPCB) has the advantages of providing not only the flexibility and bendability required by many electronic products, but also the reliability required by the key electronic components. In this study, based on one kind of RFPCB which would be used for a wearable device prototype, the structure optimization was performed by simulations. Through the structural...
In this paper we discuss the influence of solder joint geometry on the lifetime of a flip chip assembly. Geometry variations caused by variations of solder volume, pad configuration, and pad size on the printed circuit board (PCB) were taken into account. Typically these parameters vary due to technological fabrication tolerances. Consequently, the influence of such design aspects on system reliability...
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