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There are many optimization algorithms, which can be used to find the extremum of a function. However, in optimizing the function, which is obtained from the numerical calculations, it is necessary to apply the proper global optimization algorithm. It is caused by the high nonlinearity of the numerical function's response. The nonlinear function with not known analytical form may have many local extrema...
The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (electronic control unit) depends on the thermal expansion mismatch between the materials of the device and the PCB (printed circuit board), so called local mismatch, as well as on the global deformation of the PCB induced...
A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between...
Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package...
In power packages, the DC test for RDS(ON), AC test for various parameters, test for fusing current capability, and unclamped inductive load (UIL) or unclamped inductive switching (UIS) test, are important and critical for assurance of the robust product performance, quality and reliability. The fusing current capability test tries to simulate which case has the highest fusing current capability....
This paper presents a combined numerical and experimental methodology for predicting moisture-induced effects in Package-on-Package (PoP) assemblies. The hygroscopic warpage of the assembly "PoP" is measured. Its behavior is compared with the individual components "top" and "bottom". The assembly "PoP" absorbs more moisture than the sum of the two individual...
Commercial FEM software codes do not directly support the cure dependency of polymers behavior. In electronics packaging, for example, cure shrinkage of the molding compound is consequently treated as a surplus to thermal contraction and its changes in visco-elastic behavior during curing are usually ignored. This give rise to inaccurate results and may cause difficulties even in recognizing factors...
Interfacial delamination, due to the presence of dissimilar material systems, is one of the primary concerns in electronic package design. Continuum models such as J-integral have been developed to evaluate potential delamination by defining a pre-defined crack at selected interface in the package. The interface is modeled as a discontinuity across the mating material layer. However, at molecular...
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