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The through silicon interconnection technology for stacked dies is a promising way of future package construction as it lowers yield risks of large die sizes and allows cost effective packaging solutions for heterogeneous electronic systems. Thermo-mechanical reliability dependent on processing and mounting steps as well as during testing are one major concern, which was addressed by FEA. The numerical...
As the electronic industry is making its progress to miniaturize high performance, smaller and lower-priced IC packages, 3D packaging technologies are presently used to achieve these goals. Although 3D packaging technologies are vastly studied and applied to perform better performance, low power consumption and smaller packaging size of IC packages, thermo-mechanical problems occur as well due to...
A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between...
Two new designs for copper base heat sink is proposed in this work. In some experimental and numerical simulation efforts, optimizing and predicting of the thermal characterization of the heat sink with inclined free fins is developed.
This paper presents an overview of thermal analyses of micro-electronics and micro-systems presented in the thermal analysis Track at EuroSimE since the inception of the conference in 2000. This overview is based on a bibliography of approximately 140 papers compiled in this paper. The achievements of the conference in producing an archival record in the field of micro-electronics and micro-systems...
The use of an innovative jet impingement cooling system in a power electronics application is investigated using numerical analysis. The jet impingement system, outlined by Skuriat et al, consists of a series of cells each containing an array of holes. Cooling fluid is forced through the device, forming an array of impingement jets. The jets are arranged in a manner, which induces a high degree of...
The bump on flexible lead (BoFL) is a chip-to-substrate interconnect technology which uses flexible structures to accommodate the CTE mismatch between the chip and PCB substrate and consequently should be reliable without underfill. To achieve a high flexibility, the lead-free bump is located on a flexible lead. The flexible lead consists of a copper redistribution layer (RDL) embedded in a polyimide-bridge...
This paper discusses the effect of five process parameters on the generation of post weld stresses in the pigtail fibre optic. The alignment of the fibre optic and the laser in the butterfly module become misaligned during the laser welding process of the sleeve to the ferrule. This is primarily due to post welding stresses in the fibre optic which develop during the cooling process. The mechanical...
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