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Since lead was banned from the solder joints, mechanical tests of microelectronic components and modules have gained much importance not just in mobile electronics but quite in general. The standardized JEDEC drop test is commonly used. It delivers repeatable results for a wide range of loads in the components mounted on the well specified test PCB. As yet the JEDEC drop test is time consuming and...
The board level drop test is intended to evaluate and compare the drop performance of surface mount electronic components. The JEDEC standardize for board level drop test address test board construction, design, material, component locations and test conditions etc. However, in actual drop test conditions, continued drops usually loosen up the mounting screw, which is not considered in JEDEC. This...
The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In...
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