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The board level drop test is intended to evaluate and compare the drop performance of surface mount electronic components. The JEDEC standardize for board level drop test address test board construction, design, material, component locations and test conditions etc. However, in actual drop test conditions, continued drops usually loosen up the mounting screw, which is not considered in JEDEC. This...
One of the driving factors for a steady reduction in wafer and cell thickness is the present shortage of polysilicon feedstock combined with the need to reduce manufacturing costs in photovoltaic module production. Therefore materials and manufacturing processes must adapt to maintain acceptable mechanical yields and module reliability. The soldering of solar cell strings is a critical step in the...
The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In...
Reliability of SnAgCu solder joints under mechanical stress is not proven, in particular for Aeronautic and High Performance (AHP) products. They are subjected to high temperatures, severe mechanical stresses and long-term mission profiles. This work is comprehended within a larger study, which has as objective the characterization of the SnAgCu alloys mechanical behaviour at the solder joint scale...
This paper presents a study of the probabilistic effects that act in addition to deterministic (mechanistic) effects to reduce the thermal cycling durability of ball grid array (BGA) interconnects as the component I/O count increases. The mechanistic drivers include increasing thermal expansion mismatch with increasing package size and increasing stress levels with decreasing solder joint size. The...
In this paper, a wrist device conception was selected to study the reliability of flexible devices by drop test simulation. In the conception device, all of the components cannot be made flexible immediately. Some of them are still rigid, such as the ball grid array (BGA), the connector, and some other big components like the vibrator. The reliability of the device, where such rigid components are...
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