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A multi-scale modeling approach is proposed and employed to investigate thermal issues and to enable "thermally aware" design of radio-frequency (RF) integrated circuits (ICs). Thermal analysis from full-chip scale down to the single transistor level was made possible with the development of this approach using the finite volume three-dimensional (3D) numerical technique. We have developed...
The ability to control mixing of reagents in MEMS systems is crucial for many biological and chemical analysis applications. However mixing in these microfluidic devices is a challenge because the flows are laminar corresponding to very low Reynolds number. In this paper, mixing of two aqueous reagents is studied in a "tau" shaped microchannel by means of computational fluid dynamics (CFD)...
Thermal interface material (TIM) is a major hurdle in heat flow for typical chip/heat sink assemblies. In many electronic devices, hot spots occur in areas of high activity during the device operation. These hot spots can lead to high thermal gradients, which in turn result in performance and reliability hindrances. The elevated, non-uniform power density confronted with conventional TIMs that contain...
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